Projects

Objective

The PIC-PAM project aims to combine photonic chip technologies with quantum communication to enhance the cybersecurity of future communication networks, data centers, and campus infrastructures. To this aim, compact and cost-effective modules are being developed that can be easily integrated into existing network infrastructure.

Project Scope

PIC-PAM is a three-year collaborative project funded by Thuringian Funding Program for Research, Technology, and Innovation (FTI) with project number 1006811 and is co-financed by the European Union. Six Thuringian partners from research and industry are involved: Quantum Optics Jena GmbH, AIM Micro Systems GmbH, X-FAB Global Services GmbH, the Fraunhofer IOF, the Institute of Applied Physics at Friedrich Schiller University Jena, and the IMMS.

Technological Approach

The project focuses on integrating all the necessary components of quantum key distribution onto a single chip. Polarization analysis is used to determine the quantum state of individual photons. SPAD-based single-photon detectors enable highly sensitive signal conversion directly on the chip. In addition, integrated timestamp electronics ensure precise synchronization of the transmitter and receiver as well as the suppression of interference signals.

The photonic components are based on silicon nitride and include, among other things, micro-optical assemblies, beam splitters, and couplers for connecting photonics, electronics, and optical fiber. In parallel, an electronic layer is being developed that integrates as many functions as possible directly and is based on CMOS-compatible processes.

Contributions from the Partners

Fraunhofer IOF is developing the chip’s photonic components, including micro-optical structures, beam splitters, and coupling elements, and is implementing the corresponding test environments in collaboration with the Institute of Applied Physics at the Friedrich Schiller University Jena. IMMS is responsible for the development and integration of the electronic functions, in particular the SPAD-based detectors and the timestamp electronics.

X-FAB provides the technological platform on which photonic and electronic structures can be fabricated together on a single wafer. AIM Micro Systems handles the assembly and interconnection technology as well as the package integration with a view to industrial production. Quantum Optics Jena develops suitable photon sources and implements the complete system demonstrator.

Application Prospects

A key objective is to implement the technology in a compact, SFP-like module that can be directly integrated into network devices. This is intended to make quantum key distribution practically usable and widely applicable.

Innovation and Regional Focus

The project brings together Thuringia’s existing expertise in photonics, microelectronics, and sensor technology, thereby strengthening the region’s innovative capacity. Close collaboration between research institutions and industry partners promotes the transfer of knowledge and technology into practical applications. The results are also transferable to other industries and contribute to strengthening the value chain beyond Thuringia.